Rockwell Automation 1769-PB4 Compact I/O Expansion Power Supplies - Manuel (Page 31)

Compact I/O Expansion Power Supplies 31
Publication 1769-IN028B-EN-P - October 2008
Wire size
2.5 mm 2 (14 AWG) solid copper wire rated at 90 °C (194 °F), or greater, 1.2 mm
(3/64 in.) insulation max
North American
temp code T3C
IEC temp code N/A T4 N/A T4
Enclosure type
rating None (open style)
(1) When configuring your system using a MicroLogix 1500 controller, only one expansion cable, one expansion power supply
and a total of eight I/O modules may be used in a maximum of two banks of I/O modules. The expansion power supply
cannot be directly connected to the MicroLogix 1500 controller.
(2) Use this Conductor Category information for planning conductor routing. Refer to Industrial Automation Wiring and
Grounding Guidelines, publication
1770-4.1 .
1769-PA2, 1769-PB2, 1769-PA4, 1769-PB4 - Environmental Specifications
Attribute 1769-PA2 1769-PB2 1769-PA4 1769-PB4
Operating
temperature
IEC 60068-2-1 (Test
Ad, Operating Cold
IEC 60068-2-2 (Test
Bd, Operating Dry
Heat)
IEC 60068-2-14
(Test Nb, Operating
Thermal Shock)
0…60 °C (32…140 °F)
Nonoperating
temperature
IEC 60068-2-1 (Test
Ab, Unpackaged
Nonoperating Cold)
IEC 60068-2-2 (Test
Bb, Unpackaged
Nonoperating Dry
Heat)
IEC 60068-2-14
(Test Na,
Unpackaged
Thermal Shock)
-40…85 °C (-40…185 °F)
Relative humidity
IEC 60068-2-30
(Test Db,
Unpackaged Damp
Heat)
5…95% noncondensing
1769-PA2, 1769-PB2, 1769-PA4, 1769-PB4 - Technical Specifications
Attribute 1769-PA2 1769-PB2 1769-PA4 1769-PB4